Fe doped LT Wafers

Specifications
Material: LiTaO3 wafers(White or Black &Fe doped)
Curie Temp: 603±2℃
Cutting Angle: X/Y/Z/X112Y/Y36/Y42/Y48/etc
Diameter/size: 3”/4”/6" LT wafer
Tol(±): <0.20 mm
Thickness: 0.18 ~ 0.5mm or more
Primary Flat: 22mm /32mm /42.5mm /57.5mm

Our abundance experience at growing and mass production for SAW grade Lithium Tantalate. We are equipped with advanced facilities at Crystal growing, wafer lapping, polishing and checking, all finished products are passed at Testing of curie Temp and QC inspection.

Our abundance experience at growing and mass production for SAW grade Lithium Tantalate. We are equipped with advanced facilities at Crystal growing, wafer lapping, polishing and checking, all finished products are passed at Testing of curie Temp and QC inspection.

Our R&D is active at developing and researching from new material to finished products at all kinds of Fe doped wafers & electronic components.

Material LiTaO3 wafers(White or Black &Fe doped)
Curie Temp 603±2℃
Cutting Angle X/Y/Z/X112Y/Y36/Y42/Y48/etc
Diameter/size 3”/4”/6″ LT wafer
Tol(±) <0.20 mm
Thickness 0.18 ~ 0.5mm or more
Primary Flat 22mm /32mm /42.5mm /57.5mm
LTV (5mmx5mm)  <1µm
TTV  <3µm
Bow -30<bow<30
Warp <40µm
PLTV(<0.5um) ≥95%(5mm*5mm)
Orientation Flat All available
Surface Type Single Side Polished /Double Sides Polished
Polished side Ra <0.5nm
Back Side Criteria General is 0.2-0.5µm or as customized
Edge Criteria R=0.2mm or Bullnose
Fe doped Fe doped for saw grade LN< wafers
Wafer Surface Criteria Transmissivity general:5.9×10-11<s<2.0*10-10 at 25℃
Contamination, None
Particles ¢>0.3 µ  m <= 30
Scratch , Chipping None
Defect No edge cracks, scratches, saw marks, stains
Packaging Qty/Wafer box 25pcs per box
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