SAW Grade Lithium Tantalate Wafers
Curie Temp: 603±2℃
Cutting Angle: X/Y/Z/X112Y/Y36/Y42/Y48/etc
Diameter/size: 3”/4”/6" LT wafer
Tol(±): <0.20 mm
Thickness: 0.18 ~ 0.5mm or more
Primary Flat: 22mm /32mm /42.5mm /57.5mm
Lithium Tantalate (LiTaO3) crystals and substrates are highly valued for their exceptional surface wave applications, making them indispensable in various industries. With its perovskite M6 crystal structure, LiTaO3 exhibits a unique combination of optical, piezoelectric, and pyroelectric properties, rendering it ideal for surface wave technology.
Hangzhou Freqcontrol Electronic Technology (CQT Group) specializes in providing LiTaO3 substrates ranging from 3 inches to 6 inches in diameter. These substrates are meticulously engineered to meet the stringent requirements of surface wave applications. Additionally, we offer black LiTaO3 wafers, enhancing their functionality and performance in specific applications.
LiTaO3 substrates are available in various cut angles optimized for surface wave propagation. Commonly utilized cut types include 36°Y, 42°Y, and X-112°Y-cut, each offering distinct surface wave propagation characteristics tailored to different application needs. These substrates exhibit remarkable electromechanical coupling coefficients and low acoustic attenuation, ensuring efficient surface wave transmission.
The introduction of black LiTaO3 wafers further enhances their utility by significantly reducing the pyroelectric effect while maintaining their piezoelectric properties. This unique feature allows blackened LT wafers to neutralize electrical charges instantaneously, making them ideal for applications requiring rapid response and precise control.
| Material | LiTaO3 wafers（White or Black） | |
| Curie Temp | 603±2℃ | |
| Cutting Angle | X/Y/Z/X112Y/Y36/Y42/Y48/etc | |
| Diameter/size | 3”/4”/6″ LT wafer | |
| Tol(±) | <0.20 mm | |
| Thickness | 0.18 ~ 0.5mm or more | |
| Primary Flat | 22mm /32mm /42.5mm /57.5mm | |
| LTV (5mmx5mm) | <1µm | |
| TTV | <3µm | |
| Bow | -30<bow<30 | |
| Warp | <40µm | |
| PLTV(<0.5um) | ≥95%(5mm*5mm) | |
| Orientation Flat | All available | |
| Surface Type | Single Side Polished /Double Sides Polished | |
| Polished side Ra | <0.5nm | |
| Back Side Criteria | General is 0.2-0.5µm or as customized | |
| Edge Criteria | R=0.2mm or Bullnose | |
| Wafer Surface Criteria | Transmissivity | general:5.9×10-11<s<2.0*10-10 at 25℃ |
| Contamination, | None | |
| Particles ￠>0.3 µ m | <= 30 | |
| Scratch , Chipping | None | |
| Defect | No edge cracks, scratches, saw marks, stains | |
| Packaging | Qty/Wafer box | 25pcs per box |
